Assembly Process 1: Chassis & Sub-Modules
Mounting of structural reinforcements, heavy-duty cooling fans, water-cooling base plates, and high-frequency ferrite transformers to the main structural frame.
At Guangdong Fenvix Technology Co., Ltd., we maintain full proprietary control over every phase of production. Unlike trading intermediaries that outsource cabinet design or rely on third-party sub-assemblies, our 3,000 m² Guangdong facility integrates precision mechanical sheet metal processing, copper busbar milling, electrical harness manufacturing, and specialized power electronics testing under one roof.
From 15,000A high-frequency electroplating rectifiers and high-voltage DC sources to solid-state 400Hz static frequency converters and 28.5V aviation ground power units (GPUs), our production capacity guarantees dimensional accuracy, thermal dissipation efficiency, and compliance with CE, EMC, and LVD industrial safety directives.
Every industrial power unit progresses through documented standard operating procedures (SOPs) designed to ensure mechanical rigidity, high dielectric strength, and long-term operating stability.
Cold-rolled steel sheets and high-conductivity copper busbars are sheared, punched, drilled, and milled with high-precision machine tools for optimal enclosure fit and minimal contact resistance.
Trained technicians install IGBT switching modules, high-frequency nanocrystalline transformers, water-cooling heatsinks, and isolated gate driver boards following strict ESD protection protocols.
Digital storage oscilloscopes examine PWM gate driving pulses, output ripple coefficient, phase balance, and voltage transition profiles to verify clean power conversion without harmonic distortion.
Every unit undergoes continuous 100% full-load burn-in at rated voltage and amperage inside our testing bays. Thermal imaging monitors temperature rise across semiconductor junctions and magnetic cores.
Visual verification of internal wiring harness routing, component layout, and load testing stations within our Guangdong plant.
Mounting of structural reinforcements, heavy-duty cooling fans, water-cooling base plates, and high-frequency ferrite transformers to the main structural frame.
Interconnection of solid high-purity T2 copper busbars, high-voltage filter capacitors, and IGBT bridge modules, treated with nickel plating to prevent oxidation.
Routing shielded signal cabling, Hall-effect current sensors, PLC control boards, digital HMI touchscreens, and isolated RS485/Modbus communication modules.
Real-load parameter tuning, safety trip verification (OVP, OCP, OTP, Phase loss), response time checks, and digital display accuracy calibration.
Direct ownership of heavy mechanical processing machinery enables swift lead times for custom enclosure sizes and tailored copper busbar designs.
Cuts industrial-grade cold-rolled steel and aluminum alloy plates with high edge straightness and zero burring for modular cabinet shells.
Executes precise perforations for heat-dissipation louvers, cable glands, circuit breaker cutouts, and panel meter mountings.
Surfaces copper heat spreaders and planes high-current contact joints to minimize thermal resistance and electrical losses at interface boundaries.
Creates uniform, high-strength threaded holes across copper terminals and cabinet mounting studs for vibration-proof bolt fastening.
Produces accurate cylindrical bores for heavy-duty output terminal bolts, water cooling pipe fittings, and lifting eyebolt hardware.
Real-time analysis of IGBT switching voltage transients, high-frequency dead-time synchronization, output current ripple, and harmonic distortion.
To eliminate failure risks in demanding 24/7 industrial electroplating, laboratory testing, and airfield operations, every system complies with documented verification milestones.
| Inspection Stage | Test Parameters & Equipment | Acceptance Criteria | Certification Compliance |
|---|---|---|---|
| Raw Material (IQC) | Copper conductivity verification, IGBT module batch checks, steel plate thickness measurement | Zero defect tolerance on core semiconductor & dielectric parts | RoHS • ISO 9001 |
| In-Process (IPQC) | Dimensional fit, busbar torque verification, crimping pull-force, insulation clearance | Strict alignment with internal CAD/CAM technical drawings | IPC Standards |
| Waveform Analysis | Multi-channel digital oscilloscope, current probes, harmonic distortion meter | Smooth switching without parasitic ringing, ripple ≤1% rated | EMC Directive |
| Dielectric & Safety | AC high-potential (Hi-Pot) test, ground continuity tester, megohmmeter | Withstand voltage ≥2000V AC for 60s, insulation >20MΩ | CE • LVD 2014/35/EU |
| Final Burn-In (OQC) | Dynamic resistive load bank, thermal imaging camera, full-rated power run | Thermal equilibrium within limits, zero protective trips under continuous load | TÜV Verified |
Consult directly with our engineering team in Guangdong. We provide full technical proposals, dimensional drawings, and competitive manufacturing quotes within 24 hours.